Authors should prepare their camera-ready manuscripts using the MS Word template or LaTeX class file provided below and submit PDFs converted from these files.

Templates for manuscript

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JJAP Conf. Proc. Vol. 5

Asia-Pacific Conference on Semiconducting Silicides and Related Materials — Science and Technology Towards Sustainable Electronics (APAC Silicide 2016)
Publication issue: May 2017
Check Statuses / Upload Revised Manuscript

JJAP Conf. Proc. Vol. 6

17th Int Conf on High Pressure in Semiconductor Physics (HPSP-17) & Workshop on High Pressure Study on Superconducting (WHS)
Publication issue: May 2017
Submission Deadline: extended until November 14, 2016
Manuscript Submission